Rogers TMM13i 2-Layer 20mil ENIG High Frequency PCB for Microwave & RF Applications

1. Introduction to TMM13i High Frequency PCB

The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while allowing for the convenience of soft substrate processing methods.

TMM13i laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials. TMM laminates are based on thermoset resins, making them reliable for wire-bonding without pad lifting or substrate deformation.

This 2-layer rigid PCB is constructed entirely with TMM13i as the core material at 20mil (0.508mm) thickness, with ENIG surface finish, white top silkscreen, and 1oz copper on both sides. Its DK of 12.85 offers excellent high-frequency performance, making it ideal for demanding applications such as chip testers, dielectric polarizers, filters, couplers, RF and microwave circuitry, and satellite communication systems.

2. Key Features

• Dielectric Constant (DK): 12.85 ± 0.35 at 10GHz

• Dielectric Constant (Design): 12.2 (8 GHz - 40 GHz)

• Dissipation Factor (Df): 0.0019 at 10GHz

• Thermal Coefficient of DK (TCDK): -70 ppm/°K (-55°C to +125°C)

• CTE matched to copper: X-axis 19 ppm/°C, Y-axis 19 ppm/°C, Z-axis 20 ppm/°C (-55°C to 288°C)

• ENIG (Electroless Nickel Immersion Gold) finish

• White top silkscreen, no solder mask

• Board dimensions: 89.65mm x 45.27mm

• Finished board thickness: 0.6mm (20mil core + copper)

• Lead-Free Process Compatible, UL 94V-0 flammability

3. Benefits

• Stable DK (12.85±0.35) — Consistent impedance control for high-frequency designs

• Low Df (0.0019 @ 10GHz) — Excellent high-frequency performance with minimal signal loss

• CTE Matched to Copper (19/19/20 ppm/°C) — High reliability plated through holes, dimensional stability

• Thermoset Resin — No softening when heated, reliable wire-bonding without pad lifting or substrate deformation

• Excellent Mechanical Properties — Resist creep and cold flow

• Chemical Resistance — Resistant to etchants and solvents used in PCB production

• No Sodium Napthanate Treatment Required — Simplified electroless plating process

• ENIG Finish — Excellent solderability, corrosion resistance, and wire bondability

• Lead-Free Process Compatible — Suitable for modern assembly processes

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Layer 1 (Top Copper) – 35 μm (1 oz)

Rogers TMM13i Substrate – 0.508 mm (20mil)

Layer 2 (Bottom Copper) – 35 μm (1 oz)

6. PCB Statistics

Components: 32

Total Pads: 54

Thru Hole Pads: 29

Top SMT Pads: 26

Bottom SMT Pads: 0

Vias: 38

Nets: 2

7. Rogers TMM13i Material – Product Introduction

The Rogers TMM13i isotropic thermoset microwave material is a ceramic thermoset polymer composite tailored for high reliability in plated thru-hole strip-line and micro-strip applications. It features an isotropic dielectric constant (Dk) and integrates the advantageous properties of both ceramic and PTFE substrates, while allowing for the convenience of soft substrate processing methods.

TMM13i laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials. TMM laminates are based on thermoset resins, making them reliable for wire-bonding without pad lifting or substrate deformation.

TMM laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material's isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

TMM laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

TMM laminates combine many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques. TMM laminates are available clad with 1/2 oz/ft² to 2 oz/ft² electrodeposited copper foil, or bonded directly to brass or aluminum plates. Substrate thicknesses of 0.015" to 0.500" are available. The base substrate is resistant to etchants and solvents used in printed circuit production. Consequently, all common PWB processes can be used to produce TMM thermoset microwave materials.

8. Features and Benefits Summary

9. TMM13i Typical Properties (Data Sheet)

10. Primary Application Areas

• RF and microwave circuitry

• Power amplifiers and combiners

• Filters and couplers

• Satellite communication systems

• Dielectric polarizers and lenses

• Chip testers

• Stripline and microstrip applications requiring high plated thru-hole reliability

11. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

• No sodium napthanate treatment required prior to electroless plating

12. Standard Thickness, Panel Sizes & Claddings

13. Data Source Notes

• Prolonged exposure in an oxidative environment may cause changes to the dielectric properties of hydrocarbon based materials. The rate of change increases at higher temperatures and is highly dependent on the circuit design. Rogers recommends that the customer evaluate each material and design combination to determine fitness for use over the entire life of the end product.

• The design Dk is an average number from several different tested lots of material and on the most common thickness/s. For more detailed information, please contact Rogers Corporation.

• All test data are typical measurement values intended to assist customers in material selection. They do not constitute any express or implied warranty and do not guarantee performance in specific applications. Customers are responsible for verifying the suitability of Rogers materials for each application.